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| (R) STPS340U/S/B POWER SCHOTTKY RECTIFIER MAIN PRODUCT CHARACTERISTICS IF(AV) VRRM Tj (max) VF (max) 3A 40 V 150 C 0.57 V A K VERY SMALL CONDUCTION LOSSES NEGLIGIBLE SWITCHING LOSSES LOW FORWARD VOLTAGE DROP LOW THERMAL RESISTANCE EXTREMELY FAST SWITCHING SURFACE MOUNTED DEVICE DESCRIPTION Single chip Schottky rectifier suited for Switch Mode Power Supplies and high frequency DC to DC converters. Packaged in SMB, SMC and DPAK this device is intended for use in low and medium voltage operation, high frequency inverters, free wheeling and polarity protection applications where low switching losses are required. ABSOLUTE RATINGS (limiting values) Symbol VRRM IF(RMS) IF(AV) IFSM IRRM Tstg Tj dV/dt Parameter Repetitive peak reverse voltage RMS forward current Average forward current Surge non repetitive forward current Repetitive peak reverse current Storage temperature range Maximum operating junction temperature Critical rate of rise of reverse voltage Tc = 135C = 0.5 TL = 105C = 0.5 DPAK NC DPAK STPS340B SMB (JEDEC DO-214AA) STPS340U SMC (JEDEC DO-214AB) STPS340S Value 40 6 10 SMB / SMC DPAK SMB / SMC Unit V A A 3 75 1 - 65 to + 150 + 150 10000 A A C C V/s tp = 10 ms Sinusoidal tp = 2 s F = 1kHz square June 1999 - Ed: 6B 1/7 STPS340U/S/B THERMAL RESISTANCES Symbol Rth (j-l) Rth (j-c) Parameter Junction to leads Junction to case SMC SMB DPAK Value 20 25 5.5 C/W Unit C/W STATIC ELECTRICAL CHARACTERISTICS Symbol Tests Conditions IR * Reverse leakage current VF * Forward voltage drop Tests Conditions Tj = 25C Tj = 125C Tj = 25C Tj = 25C Tj = 125C Tj = 125C Pulse test : * tp = 380 s, < 2 % To evaluate the maximum conduction losses use the following equation : P = 0.42 x IF(AV) + 0.050 IF2(RMS) Min. Typ. 2 VR = VRRM VR = VRRM IF = 3 A IF = 6 A IF = 3 A IF = 6 A 0.52 0.63 Max. 20 10 0.63 0.84 0.57 0.72 Unit A mA V Fig. 1: Average forward power dissipation versus average forward current. PF(av)(W) 2.5 2.0 1.5 1.0 T Fig. 2: Average current temperature ( =0.5). IF(av)(A) versus ambient = 0.1 = 0.05 = 0.2 = 0.5 3.5 3.0 =1 Rth(j-a)=Rth(j-c) (DPAK) 2.5 2.0 1.5 1.0 tp Rth(j-a)=65C/W Rth(j-a)=Rth(j-l) (SMB/SMC) T 0.5 0.0 0.0 IF(av) (A) 0.5 1.0 1.5 2.0 2.5 =tp/T 0.5 4.0 3.0 3.5 0.0 =tp/T tp Tamb(C) 50 75 100 125 150 0 25 2/7 STPS340U/S/B Fig. 3-1: Non repetitive surge peak forward current versus overload duration (SMB)(Maximum values). Fig. 3-2: Non repetitive surge peak forward current versus overload duration (SMC) (Maximum values). IM(A) 10 9 8 7 6 5 4 3 IM 2 1 0 1E-3 IM(A) 12 10 Ta=25C 8 6 Ta=25C Ta=50C 4 Ta=100C t Ta=50C IM t 2 Ta=100C =0.5 =0.5 t(s) 1E-2 1E-1 1E+0 0 1E-3 t(s) 1E-2 1E-1 1E+0 Fig. 3-3: Non repetitive surge peak forward current versus overload duration (DPAK) (Maximum values). IM(A) 50 40 30 20 10 IM t Fig. 4-1: Relative variation of thermal transient impedance junction to lead versus pulse duration (SMB). Zth(j-a)/Rth(j-a) 1.0 0.9 Printed circuit board (e=35m) 0.8 0.7 0.6 0.5 = 0.5 0.4 0.3 0.2 = 0.2 0.1 = 0.1 tp(s) Single pulse 0.0 1.0E-2 1.0E-1 1.0E+0 1.0E+1 Tc=25C Tc=50C Tc=100C =0.5 T 0 1E-3 t(s) 1E-2 1E-1 1E+0 =tp/T tp 1.0E+2 1.0E+3 Fig. 4-2: Relative variation of thermal transient impedance junction to lead versus pulse duration (SMC). Zth(j-a)/Rth(j-a) 1.0 0.9 Printed circuit board (e=35m) 0.8 0.7 0.6 0.5 = 0.5 0.4 0.3 0.2 = 0.2 0.1 = 0.1 tp(s) Single pulse 0.0 1.0E-2 1.0E-1 1.0E+0 1.0E+1 Fig. 4-3: Relative variation of thermal transient impedance junction to lead versus pulse duration(DPAK). Zth(j-a)/Rth(j-a) T =tp/T tp 1.0E+2 1.0E+3 1.0 0.9 Printed circuit board (e=35m) 0.8 0.7 0.6 = 0.5 0.5 0.4 0.3 = 0.2 0.2 = 0.1 Single pulse 0.1 0.0 1E-3 1E-2 T tp(s) =tp/T tp 1E-1 1E+0 3/7 STPS340U/S/B Fig. 5: Reverse leakage current versus reverse voltage applied (Typical values). Fig. 6: Junction capacitance versus reverse voltage applied (Typical values). IR(A) 1E-2 Tj=150C C(pF) 500 F=1MHz Tj=25C Tj=125C 200 100 50 1E-3 Tj=100C 1E-4 Tj=75C 20 VR(V) 1E-5 0 5 10 15 20 25 30 35 40 10 1 2 5 VR(V) 10 20 50 Fig. 7: Forward voltage drop versus forward current (Maximum values). Fig. 8-1: Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board FR4, copper thickness: 35m) (SMB). Rth(j-a) (C/W) 120 10.00 IFM(A) Typical values Tj=150C 100 Tj=125C 1.00 80 60 0.10 VFM(V) 0.01 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 40 20 S(Cu) (cm) 0 0 1 2 3 4 5 Fig. 8-2: Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board FR4, copper thickness: 35m) (SMC). Rth(j-a) (C/W) 100 80 60 40 20 S(Cu) (cm) 0 0 1 2 3 4 5 Fig. 8-3: Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board FR4, copper thickness: 35m) (DPAK). Rth(j-a) (C/W) 100 80 60 40 20 S(Cu) (cm) 0 0 2 4 6 8 10 12 14 16 18 20 4/7 STPS340U/S/B PACKAGE MECHANICAL DATA DPAK DIMENSIONS REF. Millimeters Min. A A1 A2 B B2 C C2 D E G H L2 L4 V2 Max 2.20 2.40 0.90 1.10 0.03 0.23 0.64 0.90 5.20 5.40 0.45 0.60 0.48 0.60 6.00 6.20 6.40 6.60 4.40 4.60 9.35 10.10 0.80 typ. 0.60 1.00 0 8 Inches Min. Max. 0.086 0.094 0.035 0.043 0.001 0.009 0.025 0.035 0.204 0.212 0.017 0.023 0.018 0.023 0.236 0.244 0.251 0.259 0.173 0.181 0.368 0.397 0.031 typ. 0.023 0.039 0 8 FOOTPRINT DIMENSIONS (in millimeters) 6.7 6.7 3 3 1.6 2.3 2.3 1.6 5/7 STPS340U/S/B PACKAGE MECHANICAL DATA SMB E1 DIMENSIONS REF. D Millimeters Min. Max. 2.45 0.20 2.20 0.41 5.60 4.60 3.95 1.60 Inches Min. 0.075 0.002 0.077 0.006 0.201 0.159 0.130 0.030 Max. 0.096 0.008 0.087 0.016 0.220 0.181 0.156 0.063 E A1 C L A2 A1 A2 b c E E1 D L b 1.90 0.05 1.95 0.15 5.10 4.05 3.30 0.75 FOOTPRINT DIMENSIONS (in millimeters) 2.3 1.52 2.75 1.52 6/7 STPS340U/S/B PACKAGE MECHANICAL DATA SMC E1 DIMENSIONS REF. A1 A2 b c E E1 E2 D L b Millimeters Min. 1.90 0.05 2.90 0.15 7.75 6.60 4.40 5.55 0.75 Max. 2.45 0.20 3.2 0.41 8.15 7.15 4.70 6.25 1.60 Inches Min. 0.075 0.002 0.114 0.006 0.305 0.260 0.173 0.218 0.030 Max. 0.096 0.008 0.126 0.016 0.321 0.281 0.185 0.246 0.063 D E A1 C L A2 E2 FOOTPRINT DIMENSIONS (in millimeters) 3.3 2.0 Ordering type STPS340U STPS340S STPS340B STPS340B-TR 4.2 Marking U34 S34 S340 S340 2.0 Package SMB SMC DPAK DPAK Weight 0.107g 0.243g 0.30g 0.30g Base qty 2500 2500 75 2500 Delivery mode Tape and reel Tape and reel Tube Tape and reel Band indicates cathode on SMB, SMC Epoxy meets UL94,V0 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics (c) 1999 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A. http://www.st.com 7/7 |
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